Sammy Shina is Professor and Director - Engineering Management Program in the Francis College of Engineering's Mechanical Engineering Department at UMass Lowell.

Sammy G. Shina

Professor Emeritus

College
Francis College of Engineering
Department
Mechanical and Industrial Engineering
Phone
978-934-2590
Email
sammy_shina@uml.edu

Expertise

Electronic manufacturing, Green design and manufacturing, Six Sigma applications, design of experiments, collaborative engineering, quality and product design

Research Interests

Electronic manufacturing, six sigma applications, design of experiments, collaborative engineering, quality & product design

Education

  • Ph D: Mechanical Engineering, (1998), Tufts University - Medford, Mass.
  • MS: Computer Science, (1972), Worcester Polytechnic Institute - Worcester, Mass.
  • BS: Electrical Engineering, (1966), Massachusetts Institute of Technology - Cambridge, Mass.
  • BS: Industrial Management, (1966), Massachusetts Institute of Technology - Cambridge, Mass.

Selected Awards and Honors

  • Faculty Award for Teaching Excellence in Mechanical Engineering (2010), Teaching - University of Massachusetts Lowell
  • Regional EPA 2006 Business, Industry and Professional Organizations Environmental Merit Awards (2006) - New England Lead Free Consortium
  • Professor of the Year, ME Department (1997), Teaching - University of Massachusetts Lowell
  • Awarded a Certificate of Appreciation, for Dedication and Service during the 1995 School Year (1995), Service, Community - Lowell High School, Lowell, MA
  • "Excellence in Design" Award, HP Waltham Waste Water Treatment plant (1982) - Metropolitan District Commission of Massachusetts

Selected Publications

  • Langford, N., Shina, S.G. (2019). Using Conformal Printed Electronics for 3D Printed Antenna Systems Building Blocks (pp. 1-16).
  • Azhar, F., Tite, K., Johnston, S.P., Hansen, C.J., Shina, S.G., Schiano, A.M., Willis, D.J. (2016). Hands-on made 4 ME: Deploying, using, developing and evaluating desktop computer numerical controlled (CNC) systems in the engineering classroom (2016-June:). ASEE Annual Conference and Exposition, Conference Proceedings
  • Vaillant, J.J., Hansen, C.J., Stolk, J., Johnston, S.P., Shina, S.G., Willis, D.J. (2015). Design and implementation of an inexpensive laboratory for providing hands-on design prototyping and manufacturing experiences to engineering students (122nd ASEE Annual Conference and Exposition: Making Value for Society:). American Society for Engineering Education
  • Shina, S.G. (2013). “Engineering Project Management”. McGraw Hill professional series
  • Gao, F., Gu, Z., Shina, S.G. (2013). 663-680 Lead-free nanosolders and nanowire joining for microelectronics/ nanoelectronics assembly and packaging (1: pp. 663-680). IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
  • Morose, G., Shina, S.G., Farrell, R. (2011). Supply chain collaboration to achieve toxics use reduction. Journal of Cleaner Production, 19(5) 397-407.
  • Shina, S.G. (2011). “Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging". Nanotech 2011 Conference
  • Shina, S.G. (2010). "Synthesis and Development of Lead Free Nano Solder for Electronics/Micro Electronics Assembly and Packaging". IMAPS New England Conference
  • Shina, S.G. (2010). “Failure Analysis Results for Evaluating the Long Term Reliability of Test Vehicles Assembled with Lead Free Materials”. IMAPS New England Conference
  • Shina, S.G. (2010). “Quality and Reliability Analysis of Lead Free PCBS in simulated Production Conditions and Long term Use". Pan Pacific Conference
  • Morose, G., Shina, S., Farrell, B., Bodmer, P., Degan, K., Pinsky, D., Ebner, K., Sarkhel, A., Anderson, R., Pasquito, H., Miller, M., Feinstein, L., Fragoza, D., Ren, E., Benson, R., Bickford, C. (2009). Long term reliability analysis of lead free and halogen free electronic assemblies (1: pp. 547-608). IPC APEX Expo 2009
  • Shina, S.G. (2009). “Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronics Assemblies”. IPC Printed Circuits Expo, APEX and the Designers Summit
  • Shina, S.G. (2009). “Quality And Reliability Testing Of Circuit Boards Assembled With Lead Free Components, Finishes, Soldering Materials And Processes In Simulated Production Conditions”. PAN PAC conference
  • Shina, S.G. (2008). SMTA Toolbox: Knowledgeable green transition management. SMT Surface Mount Technology Magazine, 22(5).
  • Shina, S.G. (2008). “Green Design and Manufacturing”. McGraw Hill professional series
  • Duffy, J.a b c d e, ., Barrington, L.f., West, C.g., McKelliget, J.a h i j, ., Niemi, E.h., Shina, S.h., Sun, H.h., Niezrecki, C.h., Parkin, R.h., Charmchi, M.h., Avitabile, P.j l m n o, . (2007). Service-learning in core courses throughout a mechanical engineering curriculum. ASEE Annual Conference and Exposition, Conference Proceedings
  • Shina, S.G. (2007). The use of six sigma principles for successful RoHS implementation. Printed Circuit Design and Manufacture, 24(4) 28-32.
  • Morose, G., Harriman, L., Shina, S., Anderson, R., Pasquito, H., Wilkish, G., Bodmer, P., Farrell, B., Goulet, J., Lauziere, P., Brinkman, J., Longworth, D., Boger, W., Buck, T., Degan, K., Lockard, D., Abbott, D., Pinsky, D., Ebner, K., Sarkhel, A., Quealy, M., Benson, R., Ballas, J., Lizotte, R. (2006). Visual and reliability testing results of circuit boards assembled with lead free components, soldering materials and processes in a simulated production environment (2: pp. 728-739). IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge
  • Shina, S.G. (2006). “The use of Six Sigma principles for successful ROHS Implementation”. Printed Circuit Design and Manufacture
  • Shina, S.G. (2006). “Visual and Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes in a Simulated Production Environment”. IPC Printed Circuits Expo, APEX and the Designers Summit
  • Shina, S.G. (2006). “Summary of New England Lead Free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards”. Pan Pacific Symposium
  • Shina, S.G., Morose, G. (2005). How surface finish and solder paste affect lead-free conversions. SMT Surface Mount Technology Magazine, 19(2) 62-66.
  • Shina, S., Harriman, L., Morose, G., Anderson, R., Pasquito, H., Wilkish, G., Farrell, B., Goulet, J., Lauzier, P., Lombardo, R., Buck, T., Longworth, D., Degan, K., Abbott, D., Pinsky, D., Sarkhel, A., Quealy, M., Dimock, F., Dimatteo, R., Benson, R., Walters, K., Ballas, J., Ulmer, C. (2005). Reliability testing results of surface mounted lead free soldering materials and processes (3: pp. 1737-1747). IPC - Electronic Circuits World Convention, Printed Circuits Expo, Apex, and the Designers Summit 2005, ECWC 10: The Perfect Fit
  • Shina, S.G., Morose, G. (2005). “Transitioning to Lead-Free Electronics: Now a Business Necessity”. New England Environmental Journal,.
  • Shina, S.G. (2005). “Lead Free Consortium Update for Process Conversion”. IPC/JEDEC 8th International Conference on Lead Free Electronic Assemblies and Components
  • Shina, S.G. (2005). “Analysis of Testing Results of Surface Mounted Lead Free Soldering Materials and Processes”. Pan Pacific Conference
  • Shina, S.G. (2005). “Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing”. APEX conference
  • Shina, S.G., Morose, G. (2005). “Lead Free Conversion Analysis for multiple PWB materials and processes”. SMT Journal
  • Shina, S.G. (2004). “Design Of Experiments For Lead Free Materials, Surface Finishes And Manufacturing Processes Of Printed Wiring Boards”. Hong Kong SMT Society Annual Conference
  • Shina, S.G. (2004). “Process and Material Selection for zero defects and superior adhesion Lead Free SMT soldering”. Hong Kong SMT society
  • Shina, S.G. (2004). “Summary of Visual and Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes”. 7th International IPC/JEDEC conference
  • Shina, S.G. (2004). “Analysis of Testing Results of Surface Mounted Lead Free Solders and Materials in Production Environments”. SMTI International
  • Shina, S.G., MacFadden, T. (2004). “Lead Free Conversion issues in Component and PWB Surface Finishes”. SMT Journal, 73.
  • Shina, S.G. (2004). “Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing”. APEX conference
  • Shina, S.G. (2003). “A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques”. SMTI International
  • Shina, S.G. (2003). “Testing Results for Lead-Free PWB’s by the Massachusetts Lead-Free Electronics Research Consortium”. IEEE International Symposium on Electronics and the Environment (ISEE)
  • Shina, S.G. (2003). “Materials and Processes for Surface Mount Lead Free Soldering”. APEX Conference
  • Shina, S.G. (2002). “A Cpk-Based Toolkit for Tolerance Analysis and Design”. Engineering Design Conference
  • Shina, S.G. (2002). “Six Sigma for Electronics Design and Manufacturing”. McGraw Hill
  • Shina, S.G. (2001). “Design Of Experiments”. Electrochemical Publications Ltd
  • Shina, S.G. (2001). "Manufacturing Costs for electronic Products” (pp. 2727-2735). Elesevier Press
  • Shina, S.G. (2001). “Process and Material Selection for zero defects and superior adhesion Lead Free SMT soldering”. SMTA International Conference
  • Shina, S.G. (2001). "Reliability Testing Techniques for Lead Free Soldering Of SMT Technology”. Japanese Journal ANBE, SMT
  • Shina, S.G. (2001). “Design Of Experiments For Lead Free Materials, Surface Finishes And Manufacturing Processes Of Printed Wiring Boards”. Chinese Electronics Association Journal
  • Shina, S.G. (2001). "Reliability Testing Techniques for Lead Free Soldering Of SMT Technology”. ETRONIX Conference
  • Shina, S.G. (2001). “Selecting Material and Process Parameters for Lead Free SMT Soldering Using Design of Experiments Techniques”. Apex Conference
  • Shina, S.G., Saigal, A. (2000). Using Cpk as a design tool for new system development. Quality Engineering, 12(4) 551-560.
  • Shina, S.G. (2000). “Design Of Experiments For Lead Free Materials, Surface Finishes And Manufacturing Processes Of Printed Wiring Boards”. SMTA International Conference
  • Shina, S.G. (1999). Contract manufacturing at work: How to avoid the pitfalls of outsourcing in a global economy. American Society of Mechanical Engineers, Manufacturing Engineering Division, MED, 10 557-562.
  • Grover, M., Shina, S.G. (1999). Developing vias for additive technologies in Printed Wiring Board fabrication. National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), (FEB.) 77-83.
  • Shina, S.G. (1999). “When Global Manufacturing Does not Work”. International Mechanical Engineering Congress and Exposition (IMECE)
  • Shina, S.G. (1999). "Using Cpk as Design Tool for New System Development," (1: pp. 357-360). International Conference on Engineering Design (ICED)
  • Shina, S.G. (1999). “Developing Vias For Additive Technologies In Printed Wiring Board Fabrication” (pp. 77-83). NEPCON East
  • Shina, S.G., Saigal, A. (1998). A quality-based cost model for new electronic systems and products. JOM, 50(4) 29-33.
  • Shina, S.G., Saigal, A. (1998). Technology cost modeling for the manufacture of printed circuit boards in new electronic products. Journal of Manufacturing Science and Engineering, Transactions of the ASME, 120(2) 368-375.
  • Shina, S.G. (1998). "Additive Technologies: An Examination of Polymer Film Technology in Comparison to Etched Copper Circuitry" (pp. 11-17). NEPCON East
  • Shina, S.G. (1998). "Methodology for Applying Specifications in Electronics Manufacturing Equipment" (pp. 3-10). NEPCON East
  • Shina, S.G. (1998). "Technology Based Cost Modeling of Printed Circuit Boards".
  • Shina, S.G., Saigal, A. (1997). A cost model of new electronic products for use during the design and development phases. American Society of Mechanical Engineers, Design Engineering Division (Publication) DE, 94 67-74.
  • Carvalho, V., Phommovath, V., Shina, S. (1997). Evaluation of SMT screen printing stencil technologies (3: pp. 1719-1735). National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
  • Shina, S.G. (1997). Paperless system for manufacturing assembly automation (pp. 35-48). National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
  • Mickela, B., Marshall, J., Rich, S., Patel, C., Shina, S.G. (1997). Paste qualification for SMT processes (pp. 23-33). National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
  • Shina, S.G. (1997). "A Design Cost Model for New Products Development". ASME Winter Annual Conference
  • Shina, S.G. (1997). "A Design Cost Model for New Products Development". American Society of Metals Annual Conference
  • Shina, S.G. (1997). "Paperless Tooling System for PCB Fabrication" (pp. 33-48). NEPCON East 1997
  • Shina, S.G. (1997). "Paste Qualification for SMT process" (pp. 23-25). NEPCON East 1997
  • Shina, S.G. (1997). "Process Changes Face Industry". Mass High Tech
  • Shina, S.G. (1997). "UMASS Lowell Students team with Business". Mass High Tech
  • Shina, S.G. (1997). "Evaluation of SMT Paste and Stencil Technologies". NEPCON WEST 97
  • Shina, S.G., Saigal, A. (1996). Concurrent engineering and the virtual factory: Developing products with supply chains. American Society of Mechanical Engineers, Design Engineering Division (Publication) DE, 89 47-55.
  • Gagne, D., Quaglia, M., Shina, S.G. (1996). Method for paste selection and process optimisation for fine-pitch SMT. Soldering and Surface Mount Technology, (24) 9-11.
  • Shina, S.G. (1996). "An Algorithm for selecting the electronic design implementation in Printed Circuit Board Fabrication based on cost factors". ASME Winter Annual Conference
  • Shina, S.G. (1996). "Concurrent Engineering and the Virtual Factory: Developing Products with Contract Manufacturers". ASME Winter Annual Conference
  • Shina, S.G. (1996). "Design For Manufacture of Electronic Products" (pp. 79-100). Arab School of Science and Technology Conference on Concurrent Product and Process Design and Development
  • Shina, S.G. (1996). "Product Realization Process in a Global Environment" (pp. 79-100). Arab School of Science and Technology Conference on Concurrent Product and Process Design and Development
  • Shina, S.G. (1996). "Process Development for SMT Stencil Adhesive Application”. NEPCON East 1996
  • Shina, S.G. (1996). "Laboratory Exercises to Support Manufacturing Engineering Curriculum". International Conference on Education in Manufacturing,
  • Shina, S.G. (1996). "Method for Paste Selection and Process Optimization for Fine Pitch SMT" (pp. 61-70). NEPCON WEST 1996
  • Shina, S.G. (1994). "Successful Implementation of Concurrent Engineering Products and Processes". Van Nostrand Reinhold N.Y., reprinted by Wiley Press
  • Shina, S.G. (1994). "Technology Based Cost Modeling for Manufacturing and Material Selection in New Product Development" (pp. 85-92). ASME Winter Annual Meeting
  • Shina, S.G. (1993). "Achieving World Class Quality in PCB Manufacturing through Concurrent Engineering" (pp. 1818-1826). Proceeding of the Technical Program, NEPCON WEST 1993
  • Shina, S.G. (1992). "Performance Improvements: Application to Aerospace Rivets Installation". Winter Annual Meeting of the ASME
  • Shina, S.G. (1992). "Tuning a Large Data base Using Robust Design Techniques". Winter Annual Meeting of the ASME
  • Shina, S.G. (1992). Putting Quality Tools to Good Use, A Practical Approach" (15:10 pp. 36-39). Printed Circuit Fabrication
  • Shina, S.G. (1991). "Concurrent Engineering and Design for Manufacture of Electronic Products". Van Nostrand Reinhold N.Y., Reprinted by Kluwer Academic Publishers
  • Shina, S.G. (1991). Concurrent engineering: New rules for world-class companies. IEEE Spectrum, 28(7) 22-26.
  • Shina, S.G. (1991). "Optimizing Surface Mount Technology Soldering". Surface Mount International Conference
  • Shina, S.G. (1991). "Optimized Soldering processes using the Taguchi Method". British Electronics Conference
  • Shina, S.G. (1990). "Using the Taguchi Method to optimize Solder Processing". IPC Conference
  • Shina, S.G. (1990). "Optimized Processing and Cleaning of Hybrid Integrated Circuits" (pp. 931-940). NEPCON EAST Conference Proceedings
  • Shina, S.G. (1989). "Quality Improvement Methods for Printed Circuit Fabrication & Assembly". NEPCON SOUTHEAST Conference Professional Advancement
  • Shina, S.G. (1989). "Optimizing the new HOLLIS wave solder machine" (pp. 101-115). American Supplier Institute Seventh Symposium Proceedings
  • Shina, S.G. (1989). "Reducing Defects in a Printed Circuit Wave Soldering Process using the Taguchi Method" (pp. 205-224). NEPCON EAST Conference Proceedings
  • Shina, S.G. (1989). "An Algorithm for selecting soldering flux for cleaning and surface conductivity" (pp. 1064-1070). NEPCON WEST Conference Proceedings
  • Shina, S.G. (1988). Hewlett Packard PC Assembly Process Guidelines.
  • Shina, S.G. (1988). "Reducing Solder Wave defects in a Printed Circuit Board Wave Soldering Process" (pp. 123-144). American Supplier Institute's Sixth Symposium Proceedings
  • Shina, S.G. (1986). "Benefits of Concurrent Product/Process Development". HP Corporation Executive Conferences
  • Shina, S.G. (1986). "Mechanical Engineers go CAD". HP Monitor Magazine
  • Shina, S.G. (1985). "Mechanical Design and Test". HP engineering Symposium
  • Shina, S.G. (1985). "A PIP of a Process". HP Engineer
  • Shina, S.G. (1984). "CAD/CAM, A revolutionary way of the future". HP Monitor Magazine
  • Shina, S.G. (1984). "The Technologist" (pp. 103-108). Keeping Pace with Change, The Challenge for Engineers
  • Shina, S.G. (1982). "Trendshot Release, A Bold Change for the 1980's". HP Monitor Magazine
  • Shina, S.G. (1977). "Water Purification Project at MED". HP Monitor Magazine
  • Shina, S.G. (1977). "Justification for Dry-Film Photoresist Process". American Electroplater's Society Sixth Annual PC Conference
  • Shina, S.G. (1976). "Automatic Insertion of Components". IEEE Manufacturing Technology Conference
  • Shina, S.G. (1975). "Automatic Testing at HP Medical". IEEE Manufacturing Technology Conference
  • Shina, S.G. (1974). "Cleaning PC Boards". Circuits Manufacturing
  • Shina, S.G. (1974). "Manufacturing technology at MED". HP Monitor Magazine
  • Shina, S.G. (1972). "Microprogramming, Design Considerations".
  • Shina, S.G. (1967). "Simulation of the Massachusetts Transportation Authority (MTA) System".

Selected Presentations

  • Lead Free Consortium Research - Meeting SMTA and IEEE Reliability Boston chapters, February 2011 - Nashua, NH
  • - Pan Pacific conference, January 2006 - Kona, HI
  • - American Society of Quality, February 2005 - Manchester NH
  • - Toronto Chapter of the SMTA, November 2004 - Toronto, Canada
  • - ME department technical forums, October 2004
  • - Boston Chapter of the SMTA, September 2003
  • - Lead Free Electronics Workshop, April 2002 - Wilmington, MA
  • - Lead Free Research Summary, TURA Coordinators Conference, April 2002 - Marlborough
  • - Lead Free UMASS Consortium, November 2001 - Boston MA
  • - Lead Free at UMASS Lowell, Workshop on Modeling and Data Needs for Lead-Free Solders, February 2001
  • - State of Massachusetts Legislative committee on education policy, May 2000
  • - Career and Skill Upgrade Seminar Leader on Design for Quality using Six Sigma and Cpk Methods, April 2000 - Cambridge, MA
  • - Lead Free Electronics Symposium, April 2000 - Lucent Corporation, Haverhill, MA
  • - Lead Free Electronics, TURI Planner continuing education conference, April 2000
  • - Havestan Technical Facility, August 1999 - Ankara, Turkey
  • - Mechanical Engineering Department, March 1999 - CapeTown, South Africa
  • - Applying SPC to the SMT Manufacturing ProcessÓ, November 1998
  • - American Loudspeaker Manufacturers Conference, Symposium Panelist, January 1998 - Las Vegas Nevada
  • - Electronics Industries Forum, May 1997
  • - Arab School of Science and Technology Conference on Concurrent Product and Process Design and Development, October 1996
  • - Globatronics Conference, October 1996
  • - NAFEM Association, January 1996 - Cincinnati, Ohio
  • recruiting for the SME - UMASS Lowell SME Student branch, February 1994
  • future employment opportunities - UMASS Lowell ASME Student branch, November 1993
  • - Mortorola Incorporated Six Sigma Institute Conference, October 1993
  • - Australian Surface Mount and Printed Circuit Board Association SM93 Conference, August 1993
  • - Concurrent Engineering: Innovation, Speed and Service, Western Regional Conference, February 1993 - Oxnard, California
  • Concurrent Engineering, January 1993 - Danbury, Connecticut
  • Concurrent Engineering, Advanced Technologies - Electronics Industry Conference, January 1993 - Tel Aviv, Israel
  • - Concurrent Engineering, Engineering faculty, October 1992 - Guadalajara, Mexico
  • - IEEE Guadalajara chapter, October 1992
  • - MEXICON 92 conference, October 1992 - Guadalajara, Mexico
  • - International Society for Hybrid Microelectronics (ISHIM), May 1992
  • - Concurrent Engineering, MSME program, November 1991
  • - Hong Kong Branch of SME on "Concurrent Engineering", November 1991
  • - Concurrent Engineering, IEEE Advanced Semiconductor Manufacturing Conference, October 1991
  • "Robust Design" - Quality Conference, August 1991 - Columbia
  • - Concurrent Engineering, July 1991
  • - "Total Quality Management", April 1991 - Waltham
  • - Concurrent Engineering, March 1991
  • - "Concurrent Engineering and Design for Manufacture ", January 1991 - Minuteman Lexington High School
  • "University of Lowell Engineering Students' activities" - Leadership Conference, December 1990 - Ludlow, MA
  • - United Technologies; Hamilton Standard Division Program on Concurrent Engineering, December 1990 - Windsor Locks, Connecticut
  • - Design for Manufacture, November 1990
  • "Printed Circuit Design for Manufacture" - Valid Users Group Northeast Region Meeting, October 1990
  • Invited to critique - GENRAD Corporation Quality Program, September 1990
  • "Design for Manufacturing" - Distinguished Speaker Lecture Series, June 1990 - Gordon Institute
  • "Total Quality for the Manufacturing Enterprise" - Company Wide Quality Conference, April 1990
  • - Taguchi Methods, January 1990 - Nashua, NH
  • - Quality Methods, December 1989 - Lowell, MA
  • Quality Methods for Engineers and their Managers - Company Wide Quality Conference, November 1989
  • Quality and Productivity - Digital Equipment Corporation Senior Executives, November 1989
  • Taguchi Methods - Assurance Sciences and Technologies, Seminar Series, October 1989 - Lowell, MA
  • - Industry/Academic Corporation, joint meeting with Wang Incorporated, May 1989
  • "Design for Manufacturing" - Manufacturing Technology Conference, May 1989
  • - Taguchi Methods, November 1988

Selected Contracts, Fellowships, Grants and Sponsored Research

  • Equipment and Software Grants (), Grant -
    Shina, S.
  • Collaborative Research: Investigation of Fundamental Properties of Lead-free Nanosolders for Nanoscale (2012), Grant - NSF
    Shina, S. (Co-Principal)
  • Nano Solder Research Fellowship (2011), Fellowship - UML TURI
    Shina, S. (Co-Principal)
  • Lead and Halogen Free Material Testing (2007), - EPA
    Shina, S.
  • Lead Free Solder Testing (2006), - EPA
    Shina, S.
  • Lead Free Solder Testing (2005), - EPA
    Shina, S.
  • Hands-on MADE 4 ME (Hands-on Machining, Analysis and Design Experiences for Mecha (2013), Grant -
    Shina, S.G. (Co-Principal)
  • Collaborative Research: Investigation of Fundamental Properties of Lead-free Nano (2012), Grant -
    Shina, S.G. (Co-Principal)
  • Hands-on Machining, Analysis and Design Experiences for Mechanical Engineers (2013), Grant - NSF TUES program
    Johnston, S.P., Willis, D.J., Hansen, C.J., Shina, S.G.
  • New England Halogen Free Research Consortium Testing Project Long Term Reliabilit (2007), Grant -
    Shina, S.G. (Principal)
  • Income Account for Lead Free Consortium Schneider Automation, MACOM; and Analog Devices (2000), Grant -
    Shina, S.
  • Support for Lead Free Consortium (2002), - UML TURI
    Shina, S. (Principal)
  • Research Fellowships for Lead Free Soldering (1999), Fellowship - UML TURI
    Shina, S. (Principal)
  • Skills Training _ Machine Controls and XY Movement", Lucent Technology (2000), Grant - Corporate Education
    Shina, S.
  • Resin Technology, MFG. (Evaluation) (1999), Grant -
    Shina, S.
  • Parlex Corporation Student Interneship (1999), -
    Shina, S.
  • Coop and Internship Income Account (1998), -
    Shina, S.
  • MFG Research Fellowship for Sunny Grover, in Additive PCB's Build Up Vias (1998), Fellowship - UML TURI
    Shina, S. (Principal)
  • 05- 08112 (1998), - Microtouch Corporation, MFG
    Shina, S.G.
  • MFG Research Fellowship for Val Carvalho, Additive PCB Fabrication Technology (1997), Fellowship - UML TURI
    Shina, S. (Principal)
  • Product Development and Environmentally Appropriate Technology (1997), Grant - CITA Conception for Professors Maas, Fiddy, Geiser and McCarthy)
    Shina, S.
  • Additive PCB Fabrication Technology (1996), Fellowship - UML TURI
    Shina, S. (Principal)
  • "Manufacturing and Total Quality Management and Control" (1996), Grant - Continuing Education
    Shina, S.
  • EASNE Design for Quality (1996), Grant -
    Shina, S. (Co-Principal), Giglio, R. (Co-Principal)
  • Undergraduate Faculty Development in New Product Realization (1996), Grant - NSF
    Shina, S.
  • MFG Research Fellowship for Dennis Gagne (1996), Fellowship -
    Shina, S.G.
  • "Practical Statistics for Engineers" (1995), - USCI Baird
    Shina, S.G.
  • NO Clean Paste for PCB Assembly (1995), Fellowship - UML TURI
    Shina, S.
  • NO Clean SMT Paste for PCB Assembly (1994), Fellowship - UML TURI
    Shina, S.
  • "Undergraduate Faculty Development in Concurrent Engineering and Design for Manufacture" (1993), - National Science Foundation
    Shina, S.
  • seminars on quality and Concurrent Engineering (1989), Grant - Continuing Education
    Shina, S.
  • "Concurrent Engineering, Quality Management and Control" (1992), - Continuing Education
    Shina, S.
  • "Faculty and Course Development" (1992), Grant - GE Aircraft Engines, Education Fund
    Shina, S.
  • "Faculty and Course Development" (1991), Grant - GE Aircraft Engines, Education Fund
    Shina, S.
  • "Undergraduate Faculty Development in DFM" (1991), - National Science Foundation
    Shina, S.G.
  • "Concurrent Engineering and Design for Manufacturing" (1990), Grant - Genrad Corporation
    Shina, S.
  • "Faculty and Curriculum Development" (1990), Grant - SME Education Foundation
    Shina, S.
  • "Factory Process and material handling optimization using simulation tool" (1989), Grant - Wang Labs Incorporated
    Shina, S.
  • "Process Quality Improvements Methods" (1989), Grant - Wang Labs Incorporated
    Shina, S.
  • "Technology Transfer Grant in Manufacturing Engineering" (1989), Grant - Costa Rica Educational Development Center
    Shina, S.