Membership Details

Membership in the growing Printed Electronics Research Collaborative (PERC) community provides unique benefits to both large and small companies. These benefits include free admission to the annual PERC symposium, priority notice for collaborative research funding opportunities, access to exclusive seminars, opportunities to have visibility within the PERC network and access to current and graduating students at PERC.

As a PERC member, you will have the opportunity to collaborate with our interdisciplinary faculty team. Collaborative research projects could be in the form of company-sponsored research that targets your specific company needs. Collaborative research can also take the form of a partnership on a government-funded project. Our experience with the U.S. Manufacturing Innovation Institutes (e.g., NextFlex, America Makes) and Department of Defense (DoD) agencies provides value to companies that wish to pursue government funding. UML will prioritize the inclusion of PERC members on team formation in pursuit of government funding.

The extensive UMass Lowell (UML) equipment and design infrastructure, as found on our Facilities and Capabilities page, as well as the expertise of our faculty and staff, provides leverage in your development of printed electronics. In addition, working with our staff and students on your projects provides a pipeline to future employees.

PERC Members

  • Analog Devices
  • Ansys
  • BAE Systems
  • Creative Materials
  • Eaton
  • Remtec
  • Nano Dimension
  • Mercury Systems
  • Raytheon Technologies
  • SI2 Technologies, an ARA Company
  • RaGE Systems
  • TTM
  • Applied Nanotech Inc.
  • Flexcon

How To Become A PERC Member

  • In order to become a PERC member, there is a simple membership agreement and annual fee, which is $5,000/year
  • For any PERC member that enters into a funded research collaboration with the PERC team with an annual value of $100,000 or more, the membership fee for the following year will be waived.
  • Please contact us by emailing: PERC@uml.edu.

Annual May Symposium

The 2025 PERC Annual Symposium was held on May 29, 2025 and brought together active PERC members to share updates on ongoing and newly initiated research projects within the collaborative.

  • The event provided a platform for technical exchange, strategic discussion and networking among academic, industry and government stakeholders.
  • Joe Kunz, Chief Technology Officer of Antenna Research Associates (ARA), delivered the keynote address titled “Transitioning Printed Electronics: The Business of Technology.” His presentation drew upon decades of industry experience and addressed critical themes such as the dynamics between technology push and market pull, challenges in scalability, supply chain considerations, workforce development, and emerging opportunities in the field.
  • The keynote themes were further explored in a panel discussion featuring representatives from Raytheon, ARA, Flexcon, and Brewer Science, who offered diverse perspectives on the commercialization and future direction of printed electronics.
  • The symposium concluded with an open discussion on the strategic direction and funding landscape for PERC, followed by a networking session that included refreshments, a hosted bar, and guided tours of the research facilities.
PERC symposium 2024 pic1
Professor Alkim Akyurtlu presents to UMass Lowell students and Printed Electronics Research Collaborative members.

Virtual Seminars

PERC virtual seminars are exclusive to consortium members and are held approximately twice per year.

  • These seminars serve as a forum for open dialogue and the exchange of ideas across the printed electronics community.
  • These sessions are designed to promote technical engagement and strengthen connections among PERC partners.
  • Members are encouraged to present their technologies, ongoing research efforts, or technical challenges in order to solicit feedback and foster collaboration.
  • Presentation topics span a broad range of areas, including emerging materials for printed electronics, advances in simulation software, and innovations in design methodologies and tools.