11/27/2024
By Danielle Fretwell
Date: Tuesday, Dec. 3, 2024
Time: 10 a.m. to 12 p.m.
Location: ETIC 4th Floor
Committee:
Alkim Akyurtlu (Advisory), Professor (Associate Chair), Electrical & Computer Engineering, UMass Lowell
Oshadha Ranasingha, Assistant Professor, Electrical & Computer Engineering, UMass Lowell
Amy Peterson, Professor (Associate Chair), Plastics Engineering, UMass Lowell
Sai G.R. Avuthu, Specialist Engineer, Printed Electronics Research and Development, Eaton Research Labs
Mary Herndon, Senior Engineering Fellow Mechanical, Materials and Structures Technology, Raytheon Technologies
Brief Abstract:
Additive Manufacturing (AM) has undergone much progress in the last few years. Due to the ability to realize complex geometries much more quickly than traditional means of manufacturing, AM has been introduced into manufacturing processes in numerous technological fields, such as defense, biomedical, automotive, and others. Despite the numerous benefits that accompany the use of AM, it has yet to be used in large scale manufacturing applications with large throughput. This is due to the lack of standard knowledge in AM materials and the lack of process optimization for AM technologies. This is especially true for creating additive circuit packaging and Flexible Hybrid Electronics (FHE). This thesis addresses both the process optimization and material characterization methods for AM in these application areas. To demonstrate additive circuit packaging, an AM Near Chip Scale Interposer (NCSI) is manufactured and the process optimizations are discussed, with considerations for increased throughput manufacturing. Also discussed in this thesis is the manufacture of planar and conformal configurations of AM sensors for use in high thermal stress environments to demonstrate the implementation of FHE. Process and material optimizations are discussed in detail for such applications.